2025/10/20

The 2025 Taiwan Innotech Expo (TIE) was grandly held at Taipei World Trade Center Hall 1 from October 16 to 18. This year’s theme, “AI Cross-Domain Innovation, Intelligence Drives the Future,” brought together top global R&D teams and industry elites to showcase the limitless possibilities of technological innovation. In the “Invention Competition Area” organized by the Intellectual Property Office, Ministry of Economic Affairs, a total of 554 patents competed, with over 100 entries from the “School Invention Area,” making the competition fierce. This year, the concept of corporate talent selection was introduced, inviting Delta Electronics, Minmax Group, MSI, and Foxconn Technology Group to jointly evaluate and seek innovative achievements with market potential and industrial value.Feng Chia University’s Industry-Academia Operation and Promotion Office led six teams to outstanding performances, with all six entries winning awards: 3 golds, 2 silvers, and 1 bronze. The “Forward Vehicle Blind Spot Warning System” also won the Foxconn Technology Group Special Award, making Feng Chia one of the most prominent academic institutions at the event. The awarded projects covered cutting-edge fields such as AI smart applications, medical technology, environmental safety, and semiconductor materials, fully demonstrating Feng Chia University’s strong capabilities in cross-domain innovation and industry-academia collaboration.

Award-winning team members, including Liang Ding-Yin (Full-Stack Engineer, AI Research Center), Chen Bo-Wei (CTO), Professor Hsieh Bing-Yan (Department of Materials), Professor Shih Chih-Hsin (Department of Chemical Engineering), and Assistant Chiu Chui-Hung (Department of Automatic Control), took a group photo at the exhibition area.

Professor Lin Yu-Cheng (Department of Automatic Control) won the Bronze Award and Foxconn Technology Group Special Award for the “Forward Vehicle Blind Spot Warning System,” with Assistant Chiu Chui-Hung accepting the award on behalf of the team.
Gold Awards
Silver Awards
Bronze Award & Foxconn Technology Group Special Award
Key Technical Highlights of the Six Award-Winning Teams
Feng Chia University actively encourages faculty and students to engage in advanced research and promotes technology-industry connections through patent deployment and participation in invention competitions. Winning all awards and the Foxconn Technology Group Special Award this time not only highlights the university’s strength in cross-disciplinary R&D but also demonstrates the technical prowess and industrial application potential of its faculty teams. Looking ahead, Feng Chia will continue to drive innovation with AI technology, collaborate with industry partners, and inject more momentum into Taiwan’s smart upgrade, sustainable development, and technological progress.

Chair Professor Ho Chu-Liang’s team from the Department of Materials Science and Engineering, in collaboration with Dayong Vacuum Equipment Co., Ltd., won the Gold Award for “A Method for Preparing Carbon-Silicon Compounds,” with Dayong Vacuum R&D Director Zhan Zi-Hou personally attending the award ceremony.

Director Hsu Huai-Chung and CTO Chen Bo-Wei of the AI Research Center won the Silver Award for the “Multi-Process Event Integration Framework System.”

Associate Professor Tsai Yu-Ding of the Bachelor Program in Precision System Design won the Silver Award for the “Urination Disorder Diagnostic Device and System,” with graduate student He Jia-Xian accepting the award on behalf of the team.